Intel and 3DGS to establish $3.3B substrate plant in India

Intel and 3DGS Inc. are pouring $3.3 billion into a new substrate manufacturing plant in India’s Odisha state. The facility, located in the Bhubaneswar-Khurda region, will focus on advanced packaging technologies that are becoming increasingly critical to the global chip supply chain.

What’s actually being built

The plant will specialize in glass core substrates and high-density interconnect substrates. These are the layers that sit between a silicon chip and the circuit board it’s mounted on, routing electrical signals and managing heat. Glass core substrates offer better electrical performance and thermal stability than traditional organic alternatives.

The project is expected to take five to six years to complete. Once operational, it should create more than 1,800 direct high-skilled jobs in the region.

The announcement follows a groundbreaking ceremony on April 19, 2026, for India’s first advanced 3D glass semiconductor packaging facility. That earlier event was backed by the same Intel-3DGS partnership, suggesting a coordinated buildout rather than a one-off commitment.

A memorandum of understanding has been signed between the Odisha government, Intel, and 3DGS to formalize the arrangement.

India’s semiconductor play

The $3.3 billion Odisha plant fits into the broader India Semiconductor Mission, a government-backed initiative designed to reduce the country’s dependence on chip imports.

3DGS brings specialized expertise in glass substrate technology. Glass-based packaging solutions are specifically designed for high-performance applications including artificial intelligence, radio frequency, and photonic technologies.

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