LG Electronics’ 2.5-megawatt cooling unit qualifies as Nvidia DSX Ready

LG Electronics just earned its credentials in one of the hottest segments of AI infrastructure. Its 2.5-megawatt Coolant Distribution Unit has qualified as Nvidia DSX Ready, meaning it meets the specifications required to operate within Nvidia’s DSX AI Factory Platform.

The qualification arrived just one day after Nvidia launched its DSX Ready program on September 21, 2026. LG wasn’t just early to the party. It was practically waiting at the door.

What DSX Ready actually means

Nvidia’s DSX AI Factory Platform integrates compute, networking, power, cooling, and software into a blueprint for building next-generation AI data centers. The DSX Ready designation confirms that a piece of equipment meets those standards.

For LG’s 2.5MW CDU, that means proving it can handle direct-to-chip liquid cooling at the scale modern AI workloads demand. The unit channels coolant directly to processor chips rather than relying on traditional air cooling, which simply can’t keep up with the thermal output of dense GPU arrays anymore.

LG’s CDUs maintain temperature accuracy within plus or minus 0.25 degrees Celsius. The unit also comes equipped with virtual sensors, leak detection systems, and failover capabilities.

LG’s broader cooling strategy

This isn’t LG’s first validation in the Nvidia ecosystem. The company previously qualified a 600kW CDU on July 27, 2026, and has also secured infrastructure qualifications for 1MW models. The 2.5MW unit represents a significant step up in scale, capable of managing thermal loads from much larger AI server clusters.

Why liquid cooling is becoming non-negotiable

Liquid cooling penetration for AI chips is projected to climb from 14% in 2024 to roughly 60% by 2027. The global AI data center cooling market is expected to grow at approximately 26% annually, reaching roughly $133.5 billion by 2034.

The driving force is straightforward physics. Modern AI clusters can demand hundreds of kilowatts per rack, generating thermal loads that no amount of cold air can efficiently manage. Direct-to-chip liquid cooling solves this by placing coolant in direct contact with heat-generating components.

Disclosure: This article was edited by Editorial Team. For more information on how we create and review content, see our Editorial Policy.